diplomski rad
Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading

Ključar, Luka
Sveučilište u Zagrebu
Fakultet strojarstva i brodogradnje

Citirajte ovaj rad

Ključar, L. (2012). Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading (Diplomski rad). Zagreb: Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje. Preuzeto s https://urn.nsk.hr/urn:nbn:hr:235:431960

Ključar, Luka. "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading." Diplomski rad, Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, 2012. https://urn.nsk.hr/urn:nbn:hr:235:431960

Ključar, Luka. "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading." Diplomski rad, Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, 2012. https://urn.nsk.hr/urn:nbn:hr:235:431960

Ključar, L. (2012). 'Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading', Diplomski rad, Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, citirano: 01.05.2024., https://urn.nsk.hr/urn:nbn:hr:235:431960

Ključar L. Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading [Diplomski rad]. Zagreb: Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje; 2012 [pristupljeno 01.05.2024.] Dostupno na: https://urn.nsk.hr/urn:nbn:hr:235:431960

L. Ključar, "Fatigue strength of solder joint in electronic assemblies exposed to combined temperature and vibration cyclic loading", Diplomski rad, Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, Zagreb, 2012. Dostupno na: https://urn.nsk.hr/urn:nbn:hr:235:431960

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