Numerical modelling of heat transfer and dissipation in power electronics applications

master's thesis

• Author: Igor Vodopija
• Mentor: Milan Vujanović (mentor)
• Granter: University of Zagreb; Faculty of Mechanical Engineering and Naval Architecture; Zagreb
• Defense date and country: 2023-07-21, Croatia
• Scientific / art field, discipline and subdiscipline: TECHNICAL SCIENCES; Mechanical Engineering; Process Energy Engineering

Abstract

Ovaj se diplomski rad bavi analizom prijenosa i disipacije topline unutar sklopa elektroničkih energetskih modula koji su montirani na hladnjak, koristeći numeričke simulacije u softverskom paketu AVL FIRE M. Diplomski rad je napravljen u suradnji s tvrtkom AVL. U radu je validiran numerički model putem već napravljenih eksperimentalnih mjerenja temperature čipova. Mjerenja su napravljena u Grazu, u laboratoriju tvrtke AVL. Nakon toga napravljen je niz parametarskih analiza s ciljem analize utjecaja radnih parametara na hlađenje čipova te, posljedično, temperature sklopa. Rezultati usporedbe eksperimentalnih mjerenja i numeričkih simulacija pokazuju najveću grešku odstupanja maksimalnih temperatura u iznosu od 5.2 °C. Parametarskim analizama je pokazano da je za povećanje prijenosa topline i smanjenje pada tlaka najučinkovitije promjeniti volumni udio etilen glikola u smjesi etilen glikol-voda, koja služi kao rashladni medij u hladnjaku. Rezultati dobiveni ovim parametarskim analizama služit će za dizajniranje učinkovitijih sustava hlađenja sklopova energetske elektronike.

Abstract (english)

This Master’s Thesis focuses on analyzing heat transfer and dissipation in electronic power module assemblies mounted on coolers. The analysis is conducted using numerical simulations with the AVL FIRE M software package. This Thesis was conducted in collaboration with AVL, a leading company in the field. The Thesis problem starts with validating the numerical model by comparing it with experimental chip temperature measurements. The measurements were conducted at AVL’s laboratory in Graz. Subsequently, a series of parametric analyses were performed to investigate the impact of operating parameters on chip cooling and temperatures of the assembly’s components. The comparison between experimental measurements and numerical simulations revealed a maximum deviation error of 5.2 °C. The parametric analyses highlighted that the most effective approach to enhance heat transfer and reduce pressure drop is by adjusting the volume fraction of ethylene glycol in the ethylene glycol-water mixture used as the cooling medium, passing through the heatsink. These findings will contribute to the development of more efficient cooling systems for power electronics assemblies.

• Keywords: kondukcija; CHT; energetska elektronika; rashladni medij; hladnjak; SiC čipovi
• Keywords (english): conduction; CHT; power electronics; cooling medium; heatsink; SiC chips
• Language: croatian
• URN:NBN: urn:nbn:hr:235:760227
• Study programme: Title: Mechanical Engineering; Study programme type: university; Study level: graduate; Academic / professional title: magistar/magistra inženjer/inženjerka strojarstva (magistar/magistra inženjer/inženjerka strojarstva)
• Type of resource: Text
• File origin: Born digital
• Access conditions: Embargoed access; Embargo expiration date: 2028-07-21
• Created on: 2023-07-05 11:13:38